– Applying the principles of engineering, physics, and mathematics to component and product design/development;
– Designing integrated circuits for a wide range of sub-fields including electronics, digital computers, power engineering, telecommunications, control systems, radio-frequency engineering, signal processing, instrumentation, and microelectronics to meet and/or exceed environmental, ruggedization, and specialized requirements;
– Developing, analyzing, rapid prototyping, manufacturing, and maintenance of electronic components, sub-systems, and fully integrated circuits for products and control/feedback mechanisms to meet and/or exceed fit, form, and functionality requirements in the most cost effective and timely manner to maximize new product success.
Digital Design :
Data Acquisition System
Data Converters
Sensors
Motion Control
Microprocessors/Microcontrollers :
PICmicros
Lattice CPLD, FPGA, PLD
Altera CPLD, FPGA, DSP
Motorola 68HC11E9
System Integration :
WDM (Windows Drive Model) for PC Cards
USB Interface Following the USB 2.0 & 3.0 Architecture
Serial/RS232 port and UART 8250 following the RS232D standard
Rigid Capabilities :
2-60+ Layers
Controlled Impedance
RF and Microwave Circuits
UL Certified Laminates
High Density Interconnects
Mixed Dielectrics
Controlled Depth Back Drill
Vias in Pad
Blind and Buried Vias
Epoxy and Conductive Fill
Thick Panels Up to 0.400 in
Bonded Heath Sinks
Metal Cores
Plated Edges and Cavities
Commercial and Mil Quals
Flex Capabilities :
2-28 Layers
Complex Rigid.Flex
Epoxy Fillets
FR Acrylic
Adhesiveless Polymide
Looseleaf Construction
Bikini Coverlayer
Bookbinder Construction
Silver Epoxy Ink Shielding
Commercial and Mil Quals